Method of forming a patterned aluminum layer and article
US4869778A · kind A · utility
30Cited by
5References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 20, 1987 |
| Grant date | Sep 26, 1989 |
| Priority date | — |
| Expiry date | Jul 20, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process is described for the microdemetalization of an aluminized mylar film, the steps including the printing of a micropattern of a caustic resistant, U.V. curable resin on the aluminum surface, etching of the exposed aluminum with a warm saturated caustic solution, followed immediately by rinsing the patterned surface with an acidic solution to neutralize the caustic and stop the etching. Micropatterns having line widths as small as 0.2 mils may be formed by the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.