Encapsulated assemblage and method of making
US4869966A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 1988 |
| Grant date | Sep 26, 1989 |
| Priority date | — |
| Expiry date | May 27, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An encapsulated assemblage and a process for making an encapsulated assemblage comprising: PA1 (a) silanizing a substrate thereby forming a silanized substrate; PA1 (b) coating said silanized substrate with at least one thin extruded coherent film forming a coated substrate, said film consisting essentially of: PA2 (1) about 75 to about 90 parts by weight of a blend of: PA3 (a) about 65 to about 75 parts by weight of a selectively hydrogenated two-block polymer wherein one polymer block is designated by A and a second polmer block is designated by B such that prior to hydrogenation, PA4 (1) each A is a polymer block of a monovinyl or alpha alkyl monovinyl arene having a number average molecular weight in the range of from about 5,000 to about 75,000, said A blocks comprising from about 10 to about 40% by weight of the total block copolymer, and PA4 (2) each B is a polymer block having a number average molecular weight in the range of from about 10,000 to 150,000 and is formed by polymerizing a conjugated diene having from 4 to 10 carbon atoms per molecule, and said B blocks comprising from about 90 to about 60% weight of the total block copolymer, and PA3 (b) about 25 to about 35 p…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.