Method and device for stand-off laser drilling and cutting
US4870244A · kind A · utility
33Cited by
8References
13Claims
0Family size
Inventors
Key dates
| Filing date | Oct 7, 1988 |
| Grant date | Sep 26, 1989 |
| Priority date | — |
| Expiry date | Oct 7, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A device for perforating material and a method of stand-off drilling using a laser. In its basic form a free-running laser beam creates a melt on the target and then a Q-switched short duration pulse is used to remove the material through the creation of a laser detonation wave. The advantage is a drilling/cutting method capable of working a target at lengthy stand-off distance. The device may employ 2 lasers or a single one operated in a free-running/Q-switched dual mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.