Cooling arrangement
US4871015A · kind A · utility
8Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 1988 |
| Grant date | Oct 3, 1989 |
| Priority date | — |
| Expiry date | Jul 13, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat conducting thermal plate (55) is fixed to a thermal load (10) by means of fasteners (75). Bosses (60) on the thermal plate are received within bosses (75) on an adjacent heat exchanger (25) to maintain a sealed interengagement between those components as the thermal plate is drawn up into surface-to-surface contact with the load.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.