Reactive, thixotropic hot-melt adhesive on silane basis
US4871590A · kind A · utility
36Cited by
18References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1987 |
| Grant date | Oct 3, 1989 |
| Priority date | — |
| Expiry date | Nov 6, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/28
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thixotropic hot-melt adhesive contains reactive silane groups and is still viscous and plastically moldable after cooling. It contains a mixture of PA1 at least one thermoplastic material, and PA1 at least one thixotropic agent, wherein silane groups are contained either in the thermoplastic material itself or in at least one added silane-based binder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.