Hot melt adhesives containing an additive derived from epoxy reactive hydrogen containing polymers and compounds and a polyepoxy compound
US4871803A · kind A · utility
10Cited by
24References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 1988 |
| Grant date | Oct 3, 1989 |
| Priority date | — |
| Expiry date | Feb 3, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S206/813
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The adhesive properties of a hot melt adhesive, comprising a base polymer and a tackifying resin, can be improved by introducing into the hot melt adhesive an epoxy adduct comprising the reaction product between a compound such as a polymer having at least one active hydrogen and an epoxy compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.