Curable resin from bis-maleimide and alkenyl phenyl hydroxy ether
US4871821A · kind A · utility
22Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 1988 |
| Grant date | Oct 3, 1989 |
| Priority date | — |
| Expiry date | Mar 25, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31855
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Cured resins of high fracture toughness are prepared from N,N'-bisimides of formula I ##STR1## and alkenyl compounds of formula II EQU D(G).sub.m II in which D is an m-valent group and G represents a phenyl ring having at least one alkenyl (e.g. allyl or 1-propenyl) substituent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.