Method of making pre-formed lead-ins for an IC package
US4872260A · kind A · utility
19Cited by
7References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1988 |
| Grant date | Oct 10, 1989 |
| Priority date | — |
| Expiry date | Jan 19, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Lead-ins for IC packages are pre-formed before attachment to a package substrate. The process comprises forming lead-in segments in continuous strip with the lead-ins being maintained in position by oppositely disposed, removable rails. A segment is separated from the strip and one end of the lead-ins is formed into, e.g., a "J" shape. One rail is removed during the forming process. The last rail is not removed until the segment is mounted upon a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.