Heat sink for an electronic device
US4872505A · kind A · utility
34Cited by
11References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1988 |
| Grant date | Oct 10, 1989 |
| Priority date | — |
| Expiry date | Aug 16, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for conducting heat from an electronic device is disclosed. The device has a mounting base and two U-shaped members. Each U-shaped member has first and second walls integral with a top ridge. The first wall is integral with the base and extends away from the base and the second wall has a terminus portion proximate the first wall. Each U-shaped member is adapted to retain an electronic device between the first wall and the terminus portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.