Electrical component and method of mounting same
US4872937A · kind A · utility
4Cited by
1References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 14, 1988 |
| Grant date | Oct 10, 1989 |
| Priority date | — |
| Expiry date | Jul 14, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249983
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A mounting entity comprises, in layered order, a pressure sensitive adhesive, a foam spacer, a second pressure sensitive adhesive, a filler, and a heat sensitive adhesive. The first pressure sensitive adhesive is attached to an electrical component which is then mounted upon a printed circuit with the heat sensitive adhesive in contact therewith. The passing of the board over a solder wave heats the top surface of the board to a temperature high enough to activate the heat sensitive adhesive and adhere the component to the board. The intermediate foam layer dampens shock and vibration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.