Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
US4873136A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1988 |
| Grant date | Oct 10, 1989 |
| Priority date | — |
| Expiry date | Jun 16, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31725
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.