Polishing apparatus
US4873792A · kind A · utility
18Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1988 |
| Grant date | Oct 17, 1989 |
| Priority date | — |
| Expiry date | Jun 1, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus for polishing or grinding specimens in which the pressure between the sample and the platen against which it presses for grinding or polishing is controlled by a feedback system, which includes a strain gauge from which the sample-holding grinding shaft is suspended.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.