Process for carrying out the soldering of electronic components on a support
US4874124A · kind A · utility
7Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1988 |
| Grant date | Oct 17, 1989 |
| Priority date | — |
| Expiry date | Jan 26, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3489
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic components are welded or soldered or bonded to a support by arranging said components on the surface of the support and/or in holes piercing the support, in the presence of soldering materials having binding properties, and by then putting the thus-obtained assembly in contact with a perfluoropolyether in the liquid state, said perfluoropolyether having a temperature at least equal to that at which the soldering material develops its binding properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.