Method for applying strand filling compound
US4874442A · kind A · utility
4Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 1987 |
| Grant date | Oct 17, 1989 |
| Priority date | — |
| Expiry date | Sep 1, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B13/327
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for the application of moisture blocking compound to the interstitial spaces of a stranded conductor. The application of the compound is accomplished through the use of a cone die which regulates the amount of compound applied to the conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.