Method and apparatus for inspecting semiconductor devices for their bonding status
US4874956A · kind A · utility
10Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 1988 |
| Grant date | Oct 17, 1989 |
| Priority date | — |
| Expiry date | Apr 4, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and a method for inspecting semiconductor devices, where a focused laser beam scans the semiconductor device, and the reflected beam thereof indicating height information of the reflection positions on the semiconductor device is detected for producing detected signals. The detected signals are compared with predetermined acceptance levels of height and distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.