Optoelectronic coupling element and method for its manufacture

US4875750A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Werner Spaeth · Holzkirchen, DE
• Guenther Waitl · Regensburg, DE
• Werner Kuhlmann · Stephanskirchen, DE
• Hans-Ludwig Althaus · Lappersdorf, DE
• Rolf Birkmann · Hemau, DE
• Waltraud Klos · Regensburg, DE
• Axel Schubert · Munich, DE

Key dates

• Filing date: Feb 2, 1988
• Grant date: Oct 24, 1989
• Expiry date: Feb 2, 2008

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B6/4204
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An optoelectronic coupling element and method for manufacturing the coupling element. The coupling element includes a light wave guide, a microlens, a first carrier chip and a light emitting and/or light detecting semiconductor element. The microlens is preferably spherical in shape and is adapted for optically coupling the light wave guide and the semiconductor element. The semiconductor element can be part of the first carrier chip or, according to another embodiment, can be part of a second carrier chip. The purpose of this coupling element is to facilitate the precise mounting of the microlens in a position between the light wave guide and the semiconductor element and also facilitate the adjustment of the microlens to optimally perform its light coupling function. The method for manufacturing the coupling element provides for the formation of a receptacle having trapezoidal shape sides in the carrier chip. The microlens is mounted within the receptacle with a connecting medium such as glass. The size of the receptacle is determined by the size of the microlens and the point of contact between the microlens and carrier. Applications of the optoelectronic coupling element accord…