Thermally stable diamond abrasive compact body
US4875907A · kind A · utility
15Cited by
6References
4Claims
0Family size
Inventors
Key dates
| Filing date | Sep 23, 1987 |
| Grant date | Oct 24, 1989 |
| Priority date | — |
| Expiry date | Sep 23, 2007 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01J2203/0685
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A thermally stable diamond compact is bonded to a cemented carbide substrate through a nickel bonding layer. Bonding takes place under elevated conditions of temperature and pressure where the temperature is at least 1000.degree. C. and the pressure is at least 30 kilobars.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.