Metal conductors with improved solderability
US4876116A · kind A · utility
6Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 11, 1986 |
| Grant date | Oct 24, 1989 |
| Priority date | — |
| Expiry date | Sep 11, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02A30/14
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
When metal conductors are stored, especially in humid environments, their solderability decreases. The rate at which solderability decreases can be reduced by treating the conductor with a suitable surface active agent, particularly one which has an HLB (hydrophile-lipophile balance) number of less than 10, preferably less than 5. The surface active agent can be applied to the conductor with a suitable liquid carrier, e.g. as a solution in a mineral oil or a halogenated hydrocarbon. If desired, a polymeric insulating jacket can be melt-extruded or wrapped over the treated conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.