Selective plating by laser ablation
US4877644A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1988 |
| Grant date | Oct 31, 1989 |
| Priority date | — |
| Expiry date | Apr 12, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/146
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for the selective plating of a metal substrate on which a thin polymeric plating resist is first applied, followed by the selective removal of said resist to expose portions of said substrate to plating, and plating. More particularly, the method hereof includes the steps of selecting a laser wavelength which couples well to the metal substrate, choosing a polymer based plating resist having a low optical coefficient of absorption at said wavelength, curing said resist, subjecting selective areas of said resist to a single excimer laser shot, having a short wavelength, to cause ablative removal of the resist over the selective areas of said substrate, and subjecting said exposed portions of said substrate to metal plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.