Heat-sensitive transfer material
US4877681A · kind A · utility
15Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 2, 1989 |
| Grant date | Oct 31, 1989 |
| Priority date | — |
| Expiry date | Mar 2, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31504
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
This invention provides a heat-sensitive transfer layer which comprises a substrate and a heat-melting ink layer provided to one surface of said substrate, characterized by providing, between said substrate and heat-melting ink layer, an interlayer which breaks away within itself by separation under heat at the time of heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.