Positive-working photosensitive polyimide operated by photo induced molecular weight changes
US4877718A · kind A · utility
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7References
6Claims
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Key dates
| Filing date | Sep 26, 1988 |
| Grant date | Oct 31, 1989 |
| Priority date | — |
| Expiry date | Sep 26, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An insoluble photosensitive polyimide having the formula ##STR1## can be exposed by a pattern of light to render the exposed areas soluble. The exposed areas can then be dissolved using a solvent to leave the pattern which can be used directly as an insulator layer in a semiconductor device. A process for preparing the photosensitive soluble polyimide utilizes maleic anhydride which is irradiated by ultraviolet light to form a cyclobutane unit which is reacted with oxydianiline to form polymic acid. The polymic acid is cured using heat into the photosensitive soluble polyimide.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.