Semiconductor integrated circuit device
US4878098A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 1989 |
| Grant date | Oct 31, 1989 |
| Priority date | — |
| Expiry date | Mar 24, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor integrated circuit device according to the present invention comprises a chip substrate formed of a semiconductor. Formed on a surface of the chip substrate is an integrated circuit and a plurality of chip terminals which are located to the outside of the integrated circuit, so as to be connected thereto. An electrical insulating layer covers the entire surface of the chip substrate, and conductor leads equal in number to the chip terminals are formed on the insulating layer. One end of each conductor lead is connected to a corresponding chip terminal, and the other end thereof is formed having a connecting terminal whose surface area is greater than that of each chip terminal. The connecting terminals are distributed substantially over the entire surface of the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.