Heat dissipation package for integrated circuits
US4878108A · kind A · utility
44Cited by
12References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 15, 1987 |
| Grant date | Oct 31, 1989 |
| Priority date | — |
| Expiry date | Jun 15, 2007 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for heat dissipation of electronic components mounted on a strip of thermally conductive material. A plastic body is molded to encapsulate the component and strip with extended mold ejector pins employed to form a recess such that access to the thermally conductive strip is obtained. An external heat sink is mounted onto the plastic body. A clip or through bolt establishes thermal contact between the external heat sink and the internal thermally conductive strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.