Vacuum die mount
US4878407A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 1988 |
| Grant date | Nov 7, 1989 |
| Priority date | — |
| Expiry date | May 17, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for mounting a die, particularly a rigid cutting die, on a die cylinder includes having a bubble along a seal on the die to bridge any gaps between the die and the die cylinder when the die is initially positioned on the die cylinder. This bubble seal enables a vacuum to be applied between the initially positioned die and the die cylinder to pull the die down against and into conformity with the surface of the die cylinder, at the same time flattening the bubble seal. A key at a trailing edge of the die locates in an axial keyway in the die cylinder to circumferentially position the die; a bolt is then inserted at a leading edge of the die to establish axial location. During operation the die is held in position by the vacuum. Beam sensors and light reflectors may be incorporated to sense when a wrong die is present and shut down the apparatus. Ball valve members may be incorporated in the surface of the die to distribute the vacuum and also to enable the die to be rolled along the surface of the die cylinder while initially being positioned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.