Lead- and antimony-free solder composition
US4879096A · kind A · utility
50Cited by
7References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 19, 1989 |
| Grant date | Nov 7, 1989 |
| Priority date | — |
| Expiry date | Apr 19, 2009 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Lead-free and antimony-free solder compositions are described which comprise, as essential ingredients, about 0.05% to about 3% by weight of silver; about 0.5% to about 6% by weight of copper; about 0.1% to about 3% by weight of bismuth; and about 88% to about 99.35% by weight of tin. In preferred embodiments, the solders are also essentially free of cadmium and may also be essentially free of both cadmium and zinc.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.