Organic reinforcing fibers with bundle separation during fiber cutting
US4879179A · kind A · utility
1Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 27, 1986 |
| Grant date | Nov 7, 1989 |
| Priority date | — |
| Expiry date | Aug 27, 2006 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2978
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A high tenacity, high elongation, low shrinkage synthetic fiber is treated to enhance stiffness and interfilament coherency, then dusted with a release agent, resulting in a fiber, combined in multiple high denier bundles, which can be cut at high speed to suitable reinforcing lengths for use in reinforcing a resin matrix. The cut fiber can be used in bulk molding compounds (BMC), sheet molding compounds (TMC) and spray-up applications due to ease of cutting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.