Cooling system for an electronic circuit device
US4879632A · kind A · utility
46Cited by
3References
36Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 1986 |
| Grant date | Nov 7, 1989 |
| Priority date | — |
| Expiry date | Oct 3, 2006 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cooling system includes a cooling module which has a heat transfer plate elastically biased and exposed to the flow of a coolant for transferring heat dissipated from a circuit component on a printed circuit board to the coolant, and a solder or low-melting-point metal for establishing thermal contact between the transfer plate and the circuit component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.