Electroless gold plating solution
US4880464A · kind A · utility
9Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1988 |
| Grant date | Nov 14, 1989 |
| Priority date | — |
| Expiry date | Jan 14, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12889
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.