Method for mounting electronic parts
US4880486A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 11, 1987 |
| Grant date | Nov 14, 1989 |
| Priority date | — |
| Expiry date | Sep 11, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An adhesive containing at least two main components, and which is capable of being gelled to make it pressure-sensitive, of being photopolymerized and of being thermally polymerized, is applied at selected positions on a printed circuit substrate on which electronic parts are to be loaded. Ultraviolet rays are irradiated on the adhesive, to gelate the adhesive thereby to realize the pressure-sensitive adhesion ability by reaction of a photopolymerization functional group of the adhesive. After loading the electronic parts on the adhesive, the adhesive is hardened by reaction of a thermal polymerization functional group by heating. Thereafter, electrodes of the electronic parts and conductive lands of the printed circuit substrate are soldered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.