Hot melt adhesives containing poly(p-hydroxystyrene) homopolymers and copolymers and bonding methods employing same
US4880487A · kind A · utility
19Cited by
14References
35Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 1988 |
| Grant date | Nov 14, 1989 |
| Priority date | — |
| Expiry date | Jun 24, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition which is especially useful for bonding polyamide article to surfaces, particularly polyamide surfaces. The composition contains an ethylene-vinyl ester copolymer or a polyamide polymer, and additionally contains a poly(p-hydroxystyrene) homopolymer or a copolymer of poly(p-hydroxystyrene) with a C.sub.1 to C.sub.4 alkyl acrylate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.