Sealing and stress relief layers and use thereof

US4880684A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• David W. Boss · Beacon, US
• Timothy Carr · Morgantown, US
• Derry J. Dubetsky · Wappingers Falls, US
• George M. Greenstein · Hopewell Junction, US
• Warren D. Grobman · Austin, US
• Carl P. Hayunga · Poughkeepsie, US
• Amanda H. Kumar · Hopewell Junction, US
• Walter F. Lange · Longmont, US
• Robert H. Massey · Wappingers Falls, US
• Paul H. Palmateer · Wappingers Falls, US
• John A. Romano · Hopewell Junction, US
• Da-Yuan Shih · Poughkeepsie, US

Key dates

• Filing date: Mar 11, 1988
• Grant date: Nov 14, 1989
• Expiry date: Mar 11, 2008

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31681
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.