Novel thermosetting compositions and molding method
US4880893A · kind A · utility
5Cited by
4References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 28, 1988 |
| Grant date | Nov 14, 1989 |
| Priority date | — |
| Expiry date | Dec 28, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2361/06
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermosetting resin containing composition can be heated to reduce its viscosity and used as a liquid in a liquid injection molding method. It has a phenolic resin content of about 80% to about 90% solids by weight, and contains about 5% to about 40% of a polyglycol. The composition may also contain resorcinol as a compatibilizing agent and a polyalkylene gylcol as the polyglycol agent. In a novel method the resin containing composition is heated to reduce its viscosity and introduced into a heated mold in a liquid injection molding method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.