Patent · US Expired

Process and apparatus for sputter coating a gold alloy onto a substrate

US4882022A · kind A · utility

7Cited by

4References

12Claims

0Family size

Assignees

Leybold GmBH · DE
Demetron Gesellschaft fuer Elektronik-Werkstoffe m.b.H. · DE

Inventors

Dieter Hoffman · Bruchköbel, DE
Wolf-Dieter Munz · Somborn, DE
G. A. Horst Siewert · Alzenau, DE
Horst Dietrich · Bad Orb, DE

Key dates

Filing date	Aug 9, 1988
Grant date	Nov 21, 1989
Priority date	—
Expiry date	Aug 9, 2008

Classification

Technology area (CPC H)Electricity
CPC primaryH01J37/34
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A process using a multiple-substance alloy having a gold content most preferably in the range of 94 to 98 percent by weight as a target in a cathode sputtering apparatus is disclosed. The alloy further contains non-gold elements of aluminum, copper and preferably an element of the group of Co, Ni, G, Ti, In, Cd, Sn, Fe and Pd.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.