Method for photopatterning metallization via UV-laser ablation of the activator
US4882200A · kind A · utility
38Cited by
13References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 1988 |
| Grant date | Nov 21, 1989 |
| Priority date | — |
| Expiry date | Aug 23, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A laser, such as an excimer laser, is employed to ablate electroless plating activator material from polymer and other substrates. The treated substrates are then immersed in electroless plating baths for plating of conductive material over remaining activator material. The method is particularly effective for depositing conductive patterns on non-flat substrates and on substrates needing plated-through connections. High resolution patterns are created on any compatible polymer substrate with any compatible electroless plating activator material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.