Sawblade segments utilizing polycrystalline diamond grit
US4883500A · kind A · utility
53Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1988 |
| Grant date | Nov 28, 1989 |
| Priority date | — |
| Expiry date | Oct 25, 2008 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D1/121
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present invention provides saw blade segments comprising polycrystalline diamond cutting elements and single crystal diamond cutting elements dispersed in a bonding matrix. In a preferred embodiment abrasion resistant particles are included so as to cause non-uniform wearing of the cutting segments. In another aspect of the invention, cutting segments are provided which utilize surface set polycrystalline diamond cutting elements larger than mesh size 18.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.