Circuit substrate comprising nitride type ceramics, method for preparing it, and metallizing composition for use in it
US4883704A · kind A · utility
11Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1988 |
| Grant date | Nov 28, 1989 |
| Priority date | — |
| Expiry date | Mar 29, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
One aspect of the present invention is directed to an aluminum nitride ceramic substrate which comprises an aluminum nitride ceramic sheet and a conductive metallized layer formed thereon. The metallized layer comprises molybdenum and/or tungsten and contains a compound containing yttria and alumina in the vicinity of the interface between the aluminum nitride ceramic sintered sheet and the conductive metallized layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.