Forming a polymide pattern on a substrate
US4883744A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 1988 |
| Grant date | Nov 28, 1989 |
| Priority date | — |
| Expiry date | May 17, 2008 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/32
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A polyimide pattern is formed on a substrate by providing a layer of photosensitive polyimide precursor containing the polyimide precursor and a compound having a photosensitive group on the substrate and prebaking the layer. The layer is then exposed imagewise to actinic radiation through a photomask to form an exposed image pattern of the polyimide precursor in the layer. The unexposed areas of the layer are removed using a liquid developer and the exposed image pattern is cured by heating. In one aspect of the present invention, the prebaking step employs a judicious selection of times and temperature to eliminate the problem of formation of a white residue that occurs from using prior art prebake procedures. In another aspect of the present invention, a particular liquid developer composition is employed to facilitate the formation of sloped vias in the polyimide. In another aspect of the present invention, a particular range of exposure wavelength(s) is employed to obtain smooth walled vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.