Cooling plate with interboard connector apertures for circuit board assemblies
US4884168A · kind A · utility
92Cited by
13References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 1988 |
| Grant date | Nov 28, 1989 |
| Priority date | — |
| Expiry date | Dec 14, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20254
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling plate for heat dissipation is particularly adapted for use within printed circuit board stacks. The cooling plate includes a fluid inlet manifold, fluid pass containing a plurality of heat dissipation fins, and a fluid outlet manifold. Externally, the cooling plate has a pattern of heat conductive pads that is substantially identical to the pattern of devices on a printed circuit board attached to the cooling plate. The cooling plate includes apertures and mounting elements for z-axis connector assemblies so that printed circuit boards attached to either side of the cooling plate may electrically interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.