Forced air heat sink apparatus
US4884631A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 17, 1988 |
| Grant date | Dec 5, 1989 |
| Priority date | — |
| Expiry date | Mar 17, 2008 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24149
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A high efficiency forced air heat sink assembly employs a split feed transverse flow configuration to minimize the length of the air flow path through at least two separated fin structures. Different embodiments use different fin structure material configurations including honeycomb, corrugated and serpentine. Each such embodiment uses a thermally conductive plate having opposed exterior surfaces; one for receiving a component to be cooled and one for receiving the fin structures. The serpentine structured fin embodiment employs a plurality of fin supports extending from the plate and forming a plurality of channels for receiving the fin structures. A high thermal conductivity bondant, such as metal-filled epoxy, may be used to bond the fin structures to either the plate or the fin supports. Dip brazing and soldering may also be employed depending upon the materials selected.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.