Layered devices having surface curvature and method of constructing same
US4885055A · kind A · utility
21Cited by
11References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 21, 1987 |
| Grant date | Dec 5, 1989 |
| Priority date | — |
| Expiry date | Aug 21, 2007 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B5/10
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of treating a substrate having first and second sides with corresponding oppositely facing first and second surfaces, to produce curvature in the first surface. The method includes the steps of removing material, according to a predetermined pattern, from the second side of the substrate, and applying a stress-producing film of material to at least one surface of the substrate to thereby cause the substrate to bend to produce the desired curvature in the first surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.