Additive composition, plating bath and method for electroplating tin and/or lead
US4885064A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 1989 |
| Grant date | Dec 5, 1989 |
| Priority date | — |
| Expiry date | May 22, 2009 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
It now has been found that a smooth, level, matte and/or bright deposit of tin, lead or tin-lead alloy can be deposited on a substrate from an aqueous plating bath which comprises PA1 (A) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts; and PA1 (B) at least one alpha-acetylenic alcohol or glycol of the formula EQU R.sub.1 R.sub.2 C(OH)C.tbd.CR.sub.3 (I) PA1 wherein PA1 R.sub.1 and R.sub.2 are each independently H, an alkyl group, a cycloalkyl group or R.sub.1 and R.sub.2 together with the carbon atom form a cyclic group, provided that at least one of R.sub.1 and R.sub.2 is an alkyl group containing at least three carbon atoms, and PA1 R.sub.3 is H, an alkyl group or --C(OH)R.sub.1 R.sub.2. Preferably the plating baths do not contain fluoride or fluoborate ions, and the baths are also free of strong inorganic acids such as sulfuric acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.