Method and apparatus for the application of materials

US4885070A · kind A · utility

Assignee

• Leybold GmBH · DE

Inventors

• Gregor A. Campbell · Glendale, US
• Robert W. Conn · Los Angeles, US
• Dan M. Goebel · Pasadena, US
• Rolf Adam · Hanau, DE
• Hans Aichert · Hanau, DE
• Hans-Georg Betz · Bruchköbel, DE
• Anton Dietrich · Fontnas, CH
• Gonde Dittmer · Niederrodenbach, DE
• Klaus Hartig · Ronneburg, DE
• Friedrich Hass · Rodenbach, DE
• Rainer Ludwig · Bitburg, DE
• Max Mayr · Alzenau, DE
• Alfred J. Thelen · Santa Rosa, US

Key dates

• Filing date: May 20, 1988
• Grant date: Dec 5, 1989
• Expiry date: May 20, 2008

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01J37/3402
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An apparatus to apply materials to a substrate disposed in a vacuum chamber is disclosed. A separate generator chamber containing an electron emitter is connected to the vacuum chamber by a process chamber so that a plasma of controllable cross-sectional shape and large area is formed and guided by magnets toward a target system. Positive ions may be accelerated against the target by applying an adjustable negative voltage.