Thermosetting resin and prepreg and laminate using the same
US4886858A · kind A · utility
3Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 1987 |
| Grant date | Dec 12, 1989 |
| Priority date | — |
| Expiry date | Feb 17, 2007 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/674
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.