Organopolysiloxane composition
US4886865A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 1988 |
| Grant date | Dec 12, 1989 |
| Priority date | — |
| Expiry date | Mar 18, 2008 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/14
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The organopolysiloxane composition is useful as a potting or encapsulating material having a gel-like consistency for protecting electronic components even at an extremely low temperature as is encountered in the space industry. The composition is basically of the type in which crosslinks are formed by the addition reaction between silicon-bonded vinyl groups in an organopolysiloxane and silicon-bonded hydrogen atoms in an organohydrogenpolysiloxane but the outstanding cold resistance of the gel-like material obtained from the composition is imparted by incorporating specific silethylene-containing units of the unit formula OSiMe--CH.sub.2 CH.sub.2 --SiMe.sub.2 O.sub.0.5 into the organopolysiloxane in a specified molar content.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.