Vacuum well process
US4887544A · kind A · utility
2Cited by
16References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 14, 1988 |
| Grant date | Dec 19, 1989 |
| Priority date | — |
| Expiry date | Mar 14, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/082
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and process, including a combination of a solder well and a vacuum system wherein micro through holes are filled with solder. A PC board or the like is supported for contact with solder on one side and with a vacuum apparatus for the application of a vacuum to the other side so that solder is drawn into the through holes for establishing electrically conductive connections therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.