Apparatus for connecting external leads
US4887758A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1989 |
| Grant date | Dec 19, 1989 |
| Priority date | — |
| Expiry date | Jan 26, 2009 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for connecting or bonding leads of solid-state devices to lead frames, etc. in which a solid-state device punched out of a film carrier by a punch is first picked up and held by a suction-adhesion head. A raising and lowering arm is then driven longitudinally and laterally so that the suction-adhesion head with the solid-state device thereon is moved to a position over a first bonding station. Then, the raising and lowering arm is lowered via a vertical driving mechanism, and the solid-state device held by the suction-adhesion head is pressed against a specified lead frame. A first bonding tool is lowered and simultaneously bonds the leads on two opposite sides of the solid-state device to the lead frame. Then, the first bonding tool is raised, and the suction-adhesion head is raised and moves back to a position over the punch. The lead frame to which two sides of the solid-state device have been thus bonded is fed, and at a second bonding position, the leads on the other two opposite sides of the solid-state device are bonded to the lead frame by a second bonding tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.