Method for improving the bond strength of Saran polymers to polyamides
US4888249A · kind A · utility
6Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1989 |
| Grant date | Dec 19, 1989 |
| Priority date | — |
| Expiry date | Mar 28, 2009 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31757
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for bonding homopolymers or copolymers of vinylidene chloride to polyamides which method comprises blending the polymer or copolymer with low density polyethylene, high density polyethylene, linear low density polyethylene, homopolymer or copolymer of propylene, or a copolymer of ethylene and acrylic acid, methacrylic acid and a small amount of copolymer of ethylene and a lower alkyl or hydroxyalkyl ester of acrylic or methacrylic acid and then contacting the blend of polymers with the polyamide under heat and pressure. Unexpected adhesion between the Saran blend and the polyamide was found.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.