Patent · US Expired

Method and apparatus for forming and bonding metal assemblies

US4889276A · kind A · utility

46Cited by
8References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 7, 1988
Grant dateDec 26, 1989
Priority date
Expiry dateNov 7, 2008

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB23K20/00
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A method and apparatus for forming and bonding metal assemblies using an internally heated chamber. The parts can be both superplastic formed and diffusion bonded to other parts. A closable chamber contains a heating element near the chamber center. A ceramic die at least partially surrounding the heating element has a forming surface toward the heating element. The inner wall of the chamber is lined with a pressure bladder. A granular material, conical ceramic support, or extensible bladder fills the space between ceramic die and chamber inner wall. With the chamber closed, the heater is activated while an inert gas under pressure is introduced between heater and die and the bladder if used is pressurized. The bladder or packed granules support the outer die surface while the gas pressure presses metal parts on the die forming surface against the die. The metal parts are formed and bonded together by the substantially isostatic forces thereon. The heat is concentrated on the parts, leaving the chamber walls cold. When forming is complete, the chamber interior is cooled and the die is removed and broken away from the formed assembly. Parts can be formed and bonded rapidly with a co…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.