Method for selectively forming small diameter holes in polyimide/Kevlar substrates
US4889585A · kind A · utility
3Cited by
10References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 1988 |
| Grant date | Dec 26, 1989 |
| Priority date | — |
| Expiry date | May 31, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0789
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods for forming small diameter holes in polyimide/Kelvar.RTM. substrates utilize hot concentrated sulfuric acid and then honing, as necessary, with liquid abradant slurries to smooth uneven edges of the openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.