Thin film forming device
US4890575A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 1987 |
| Grant date | Jan 2, 1990 |
| Priority date | — |
| Expiry date | Jul 14, 2007 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23G5/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A thin film forming device comprises a vacuum tank held at the predetermined degree of vaccum; a substrate placed in the vacuum tank; internal tanks disposed in the vacuum tank and each having an opening opposite to the substrate; gas jet nozzles, one arranged in each of the internal tanks and connected with reactive gas sources outside the vacuum tank, for jetting reactive gases of different types toward the substrate through the openings of the internal tanks; and electron beam irradiation devices disposed close to a passage, through which the reactive gases jetted from the gas jet nozzles pass, for irradiating electron beams to the reactive gases.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.